A few days ago Xiaomi presented its new improved Mi 9. A new variant preceded by the name "Pro" that is characterized by incorporating 5G connectivity , superior performance thanks to its Snapdragon 855 Plus and various new features such as the support for reversible 10W charging .
Now, the firm has wanted to show us with great detail the interior of this new device. A complete Teardown where we can appreciate practically all the internal components of this Xiaomi Mi 9 Pro 5G , passing from its processor, RAM or wireless charging, to the area where the NFC chipsets or 5G connectivity are located.
With splash and dust protection
As we can see under these lines and as also happens with the latest Xiaomi and Redmi smartphones, this new Mi 9 Pro 5G incorporates various protection systems against splashes and dust . In addition, the edge of the device is covered with a special foam whose objective is to achieve greater sealing.
The second image shows us its large graphite plate , capable of guaranteeing greater heat dissipation from its processor and chips incorporated in the main board. With this, the temperature of its Snapdragon 855 Plus processor that already has an overclock in itself, is kept at quite cool figures.
A total of three cameras and up to 512GB of UFS 2.1 internal memory
Next, Xiaomi shows us the three cameras of the Mi 9 Pro 5G, its main 48MP , as well as the 12MP telephoto lens or its 16MP wide angle. In addition, as a selfie camera we can see its 20MP sensor.
Later we find its main board where the Snapdragon 855 Plus processor , the LPDDR4x RAM module , the UFS 2.1 type internal memory and the rest of connection chips such as WiFi or Bluetooth are housed.
In the rest of the images we can see the different NFC, WiFi or Bluetooth chips, its USB TIpo C connector or the 4,000mAh battery equipped with 40W fast charging, 30W wireless charging and as a great novelty, 10W reversible charging with the that share power with other smartphones or gadgets compatible with wireless charging.
Source | Weibo